Advanced Electric Power Conversion Laboratory

Faculty
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Minfan Fu (傅旻帆), Ph.D.

Google Scholar Profile

Position: Principle Investigator, AEPCL Director (研究员,博导,IEEE高级会员)

Office: Room 534, SIST Building 3, ShanghaiTech University

Laboratory: Room 507, SIST Building 3, ShanghaiTech University

Email: fumf@shanghaitech.edu.cn

Phone: (+86) 021-2068-4455

Biography: Dr. Minfan Fu received the B.S., M.S., and Ph.D. degrees inelectrical and computer engineering from University of Michigan-Shanghai JiaoTong University Joint Institute, Shanghai Jiao Tong University, Shanghai, Chinain 2010, 2013, and 2016. He is currently a Principle Investigator at School ofInformation Science and Technology (SIST), ShanghaiTech University, Shanghai,China. Between 2016 and 2018, he held a postdoctoral position with the Centerfor Power Electronics Systems (CPES), Virginia Polytechnic Institute and StateUniversity, Blacksburg, VA, USA.

His researchinterests include wireless power transfer, ultra-high-frequency powerconversion, applications of wide-band-gap devices, magnetic integration,modeling and control of resonant convertors, ubiquitous power IoT, AI and bigdata based intelligent power network. Since 2010, he has a close connection with the industrypartners (including Huawei, Intel, and Qualcomm) in this research domain, andthe overall industrial funding is over 2.5 million RMB. At CPES, he worked withDr. Fred C. Lee, a National Academy of Engineering member and IEEE Fellow, andextended his expertise to the field of high-frequency power electronics. Hedeveloped the next-generation GaN-based DC-DC module. Compared to thestate-of-the-art products, the peak efficiency and power density have increasedfrom 91% to 96% and from 88 W/inch3 to 130 W/inch3.

He is a senior member of IEEE and asenior member of CPSS. He holds seven patents and has published over 50 papersin prestigious IEEE journals and conferences, such as IEEE Trans. IndustrialElectronics and IEEE Trans. Power Electronics. Currently, his total googlescholar citations exceeds 1300, and one of his first papers was listed byEssential Science Indicators (ESI) as top 1% highly cited papers in engineeringand publication years. His conf. paper for IECON 2019 won the IES-SYPAcompetition (<1%). He serves as the section chair for several internationalconferences (such as VEH, IECON, ECCE-Asia). Currently, he serves as a reviewerfor IEEE Transactions on Power Electronics, IEEE Transactions on IndustrialElectronics, IEEE Transactions on Industrial Informatics, IEEE Transactions onMicrowave Theory and Techniques, and IEEE Transactions on Vehicular Technology,etc. In 2019, he is honored as the "Shanghai Eastern Scholar".

Teaching:

Industry Practice, Undergraduatelevel, 1 credit, 2018 Summer

SI100B, Introduction to InformationScience and Technology, Undergraduate level, 4 credits (2019 Spring,2020 Spring)

EE273, Advanced Power ConversionTechniques, Graduate level, 4 credits (2018 Fall, 2019 Fall)

EE171, Power Electronics,Undergraduate level, 4 credits (2019 Spring, 2020 Spring, 2021 Spring)

EE111, Electronic Circuits,Undergraduate level, 4 credits (2021 Spring)

Activity &Service:

Senior member: IEEE, CPSS, CES

Member: IEEE Industrial Electronics Society, IEEE PowerElectronics Society

Associate Editor: IEEE IES Industrial Electronics Technology News (ITeN)

OrganizationCommittee ChairICWPT2021

Technical ProgramCommittee Member: IPEMC2020-ECCE Asia

Section Chair: IECON 2019, VEH 2019, CPSSC 2019, IPEMC2020-ECCEAsia

Technical PaperReviewer: IEEETransactions on Power Electronics, IEEE Transactions on IndustrialElectronics, IEEE Transactions on Industrial Informatics, IEEETransactions on Microwave Theory and Techniques, IEEE Transactions onVehicular Technology, etc.

Tutorial Speaker

§   "Multi-Megahertz Wireless Power Transfer Systems",IPEMC2020-ECCE Asia, Nov 29-Dec 2, 2020, Nanjing, China.

§   "System-Level Design and Optimization of Multi-Megahertz Wireless Power Transfer Systems", ISIE 2020, June 17-19, 2020, Delft, TheNetherlands.

§   "EmergingApplications and Designs of High-Frequency Wireless Power Transfer Systems", ISIE 2021, online, June 20-23, 2021.

§   "Analysis and Design of Near-Field Couplers for Wireless Charging Applications", PEAS 2021, Shanghai, China, Nov. 12-15, 2021.




Ph.D. Students

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Peng Zhao (赵鹏), 2018 Fall

2018.9-present, ShanghaiTech University

2013.9-2017.6, B.S., Hefei University of Technology

Interests: high-frequency power converters

Email: zhaopeng@shanghaitech.edu.cn

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Guangdong Ning (宁广栋), 2019 Fall

2019.9-present, ShanghaiTech University

2013.9-2017.6, B.S., Nanjing University of Aeronautics

and Astronautics

Interests: modular design for resonant converters

Email: ninggd@shanghaitech.edu.cn


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Rong He (贺蓉), 2018 Fall

2018.9-present, ShanghaiTech University

2014.9-2018.6, B.S., Harbin Institute of Technology

Interests: control of multiple-coil IPT systems

Email: herong@shanghaitech.edu.cn

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Guangce Zheng (郑广策), 2019 Fall

2019.9-present, ShanghaiTech University

2015.9-2019.6, B.S., ShanghaiTech University

Interests: modeling of resonant converters

Email: zhenggc@shanghaitech.edu.cn


M.S. Students

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Yifan Jiang (蒋祎璠), 2019 Fall

2019.9-present, ShanghaiTech University

2015.9-2019.6, B.S., Shanghai University of Electric Power

Interests: high-efficiency power amplifier

Email: jiangyf1@shanghaitech.edu.cn

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Heyuan Li (李鹤远), 2020 Fall

2020.9-present, ShanghaiTech University

2016.9-2020.6, University of Shanghai for Sci. & Tech.

Interests: radiation model for WPT

Email: lihy4@shanghaitech.edu.cn

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Maode Zhou (周茂德), 2020 Fall

2020.9-present, ShanghaiTech University

2015.9-2019.6, B.S., Shanghai University

Interests: simultaneous wireless power and data transfer

Email: zhoumd1@shanghaitech.edu.cn

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Xinlin Wang (汪鑫林), 2021 Fall

2021.9-present, ShanghaiTech University

2016.9-2020.6, B.S., Hohai University

Interests:

Email: wangxl3@shanghaitech.edu.cn


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Kai Zhao (赵凯), 2019 Fall

2019.9-present, ShanghaiTech University

2015.9-2019.6, B.S., Xi'an University of Technology

Interests: bidirectional IPT systems

Email: zhaokai@shanghaitech.edu.cn

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Yiming Yin (尹毅明), 2020 Fall

2020.9-present, ShanghaiTech University

2016.9-2020.6, B.S., ShanghaiTech University

Interests: hybrid near-field coupler

Email: yinym@shanghaitech.edu.cn

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Xiaoxuan Ji (吉晓璇), 2021 Fall

2021.9-present, ShanghaiTech University

2017.9-2021.6, B.S., Central South University

Interests

Email: jixx@shanghaitech.edu.cn


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Chaoqun Qi (祁超群), 2021 Fall

2021.9-present, ShanghaiTech University

2017.9-2021.6, B.S., Jilin University

Interests:

Email: qichq@shanghaitech.edu.cn


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Alumni

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Shiying Wang (王世颖), M.S. degree, 2020

2017.9-2020.6, M.S., ShanghaiTech University

2013.9-2017.6, B.S., Guangzhou University

Interests: modeling and compensation of CPT

Email: wangshy2@shanghaitech.edu.cn

Whereabouts:University of Wisconsin–Madison

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Yipeng Liu (刘一鹏), M.S. degree, 2021

2018.9-2020.6, M.S., ShanghaiTech University

2014.9-2018.6, B.S., Hefei University of Technology

Interests: design of capacitive coupler

Email: liuyp@shanghaitech.edu.cn

Whereabouts: Huawei