Minfan Fu (傅旻帆), Ph.D.
Position: Principle Investigator, AEPCL Director (研究员，博导，IEEE高级会员)
Office: Room 534, SIST Building 3, ShanghaiTech University
Laboratory: Room 507, SIST Building 3, ShanghaiTech University
Phone: (+86) 021-2068-4455
Biography: Dr. Minfan Fu received the B.S., M.S., and Ph.D. degrees inelectrical and computer engineering from University of Michigan-Shanghai JiaoTong University Joint Institute, Shanghai Jiao Tong University, Shanghai, Chinain 2010, 2013, and 2016. He is currently a Principle Investigator at School ofInformation Science and Technology (SIST), ShanghaiTech University, Shanghai,China. Between 2016 and 2018, he held a postdoctoral position with the Centerfor Power Electronics Systems (CPES), Virginia Polytechnic Institute and StateUniversity, Blacksburg, VA, USA.
His researchinterests include wireless power transfer, ultra-high-frequency powerconversion, applications of wide-band-gap devices, magnetic integration,modeling and control of resonant convertors, ubiquitous power IoT, AI and bigdata based intelligent power network. Since 2010, he has a close connection with the industrypartners (including Huawei, Intel, and Qualcomm) in this research domain, andthe overall industrial funding is over 2.5 million RMB. At CPES, he worked withDr. Fred C. Lee, a National Academy of Engineering member and IEEE Fellow, andextended his expertise to the field of high-frequency power electronics. Hedeveloped the next-generation GaN-based DC-DC module. Compared to thestate-of-the-art products, the peak efficiency and power density have increasedfrom 91% to 96% and from 88 W/inch3 to 130 W/inch3.
He is a senior member of IEEE and asenior member of CPSS. He holds seven patents and has published over 50 papersin prestigious IEEE journals and conferences, such as IEEE Trans. IndustrialElectronics and IEEE Trans. Power Electronics. Currently, his total googlescholar citations exceeds 1300, and one of his first papers was listed byEssential Science Indicators (ESI) as top 1% highly cited papers in engineeringand publication years. His conf. paper for IECON 2019 won the IES-SYPAcompetition (<1%). He serves as the section chair for several internationalconferences (such as VEH, IECON, ECCE-Asia). Currently, he serves as a reviewerfor IEEE Transactions on Power Electronics, IEEE Transactions on IndustrialElectronics, IEEE Transactions on Industrial Informatics, IEEE Transactions onMicrowave Theory and Techniques, and IEEE Transactions on Vehicular Technology,etc. In 2019, he is honored as the "Shanghai Eastern Scholar".
Industry Practice, Undergraduatelevel, 1 credit, 2018 Summer
SI100B, Introduction to InformationScience and Technology, Undergraduate level, 4 credits (2019 Spring,2020 Spring)
EE273, Advanced Power ConversionTechniques, Graduate level, 4 credits (2018 Fall, 2019 Fall)
EE171, Power Electronics,Undergraduate level, 4 credits (2019 Spring, 2020 Spring, 2021 Spring)
EE111, Electronic Circuits,Undergraduate level, 4 credits (2021 Spring)
Senior member: IEEE, CPSS, CES
Member: IEEE Industrial Electronics Society, IEEE PowerElectronics Society
Associate Editor: IEEE IES Industrial Electronics Technology News (ITeN)
Technical ProgramCommittee Member: IPEMC2020-ECCE Asia
Section Chair: IECON 2019, VEH 2019, CPSSC 2019, IPEMC2020-ECCEAsia
Technical PaperReviewer: IEEETransactions on Power Electronics, IEEE Transactions on IndustrialElectronics, IEEE Transactions on Industrial Informatics, IEEETransactions on Microwave Theory and Techniques, IEEE Transactions onVehicular Technology, etc.
§ "Multi-Megahertz Wireless Power Transfer Systems",IPEMC2020-ECCE Asia, Nov 29-Dec 2, 2020, Nanjing, China.
§ "System-Level Design and Optimization of Multi-Megahertz Wireless Power Transfer Systems", ISIE 2020, June 17-19, 2020, Delft, TheNetherlands.
§ "EmergingApplications and Designs of High-Frequency Wireless Power Transfer Systems", ISIE 2021, online, June 20-23, 2021.
§ "Analysis and Design of Near-Field Couplers for Wireless Charging Applications", PEAS 2021, Shanghai, China, Nov. 12-15, 2021.